Surface roughness effect on copper-alumina adhesion

The surface roughness of the substrate itself could play an important role for the bonding at the interface. In this paper, a correlation of the surface roughness of a rigid alumina substrate and its 2D model of estimated surface area has been studied using Atomic Force Microscopy (AFM). With rougher surface, the adhesive strength between a deposited copper film and the alumina substrate is higher due to the larger contact area at the interface. For 99.99% pure copper96% pure alumina, this effect can account for an adhesive strength increment of more than 50%. Corresponding author [email protected] Tel: +65 96437005 Surface Roughness Effect on Copper-Alumina Adhesion Lim Ju Dy, Yeow Su Yi Susan, Daniel Rhee MinWoo, Leong Kam Chew, Wong Chee Cheong